RF360 - A Qualcomm-TDK joint venture / B39431R0969H110
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B39431R0969H110
| Monaróir Cuid Uimhir: | B39431R0969H110 |
| Monaróir: | RF360 - A Qualcomm-TDK joint venture |
| Cuid den Tuairisc: | SAW RES 434.4200MHZ SMD |
| Bileoga sonraí: | B39431R0969H110 Bileoga sonraí |
| Stádas Saor in Aisce Luaidhe / Stádas RoHS: | Comhlíontach Saor in Aisce / RoHS |
| Coinníoll Stoic: | I stoc |
| Long Ó: | Hong Kong |
| Bealach Seolta: | DHL/Fedex/TNT/UPS/EMS |
- CUIMHNIGH
- Tá RF360 - A Qualcomm-TDK joint venture # C1 # ar fáil ag chipnets.com. Ní dhíolaimid ach New & Original Part agus tairgeann muid am baránta 1 bhliain. Más mian leat tuilleadh a fháil amach faoi na táirgí nó praghas níos fearr a chur i bhfeidhm, déan teagmháil linn cliceáil ar an gComhrá Ar Líne nó cuir luachan chugainn.
Beidh na Comhpháirteanna Eelctronics go léir ag pacáil isteach go sábháilte trí chosaint fhrithstatach ESD.
Sonraíocht
| Cineál | Cur síos |
|---|---|
| Sraith | B39431 |
| Pacáiste | Tape & Reel (TR) |
| Stádas Cuid | Active |
| Cineál | SAW |
| Minicíocht | 434.42 MHz |
| Cobhsaíocht Minicíochta | ±50ppm |
| Lamháltas Minicíochta | - |
| Gnéithe | - |
| Capacitance | - |
| Impedance | 50 Ohms |
| Teocht Oibriúcháin | -40°C ~ 125°C |
| Cineál Gléasta | Surface Mount |
| Pacáiste / Cás | 6-SMD, No Lead |
| Méid / Toise | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| Airde | 0.039" (1.00mm) |
Stádas Stoic: Loingseoireacht an Lá céanna
Íosmhéid: 1
| Cainníocht | Praghas aonaid | Ext. Praghas |
|---|---|---|
|
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Ríomh lasta
US $ 40 le FedEx.
Teacht i 3-5 lá
Sloinn: (FEDEX, UPS, DHL, TNT) Seolta saor in aisce ar an gcéad 0.5kg d’orduithe os cionn 150 $, Gearrfar róthrom ar leithligh
Múnlaí Coitianta
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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